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TIBC Corporation (TIBC) was established as a joint venture with the No.1 manufacturer of semiconductor package substrates, Ibiden Co., Ltd. and now manufactures advanced semiconductor package substrates. These products include flip chip (FC) package substrates for use in sophisticated IC, and TIBC leads the next generation semiconductor package substrate market.
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Product Information
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Flip Chip (FC) Package Substrate (for Computer MPUs) |
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Flip chip plastic package substrates are used in MPUs (Micro Processing Units) which are at the cores of computers. Our cutting-edge products are able to meet the needs of increasingly sophisticated computers, and so we are providing them to the world's largest MPU manufacturers. |
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