Semiconductor Package Substrates

TIBC Corporation (TIBC) was established as a joint venture with the No.1 manufacturer of semiconductor package substrates, Ibiden Co., Ltd. and now manufactures advanced semiconductor package substrates. These products include space-saving, light weight flip chip (FC) package substrates for use in sophisticated IC, wire bonding (WB) package substrates, and flexible printed circuit (FPC) package substrates for use in IC cards, etc. TIBC leads the next generation semiconductor package substrate market.

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Product Information

Wire Bonding (WB) Package Substrate (for Digital Devices)
	Wire bonding (WB) plastic package substrates are essential for computers and other information devices. The increasing speed and miniaturization of electronic products has expanded the need for these substrates, and demand will continue to rise for their use in computers, mobile phones, digital video cameras, and PDAs, etc.
Flip Chip (FC) Package Substrate (for Computer MPUs)
	Flip chip plastic package substrates are used in MPUs (Micro Processing Units) which are at the cores of computers. Our cutting-edge products are able to meet the needs of increasingly sophisticated computers, and so we are providing them to the world's largest MPU manufacturers.
Flexible Printed Circuit (FPC) Package Substrate (for IC Cards)
	Flexible printed circuit package substrates are now being used in a variety of places, such as cash cards and credits cards, as well as hospital patient registration tickets, train commuter passes, and ETC (the highway Electronic Toll Collection system), etc. This product is invaluable to the rapid advance of today's lifestyles.

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